Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation
Insights into the mechanism of reflow soldering temperature curve, a mathematical model of the temperature change of the circuit board surface is established. The heat transfer methods, heat radiation and heat convection is analyzed in detail. The curve of air temperature inside the reflow furnace i...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2021-01-01
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| Series: | E3S Web of Conferences |
| Online Access: | https://www.e3s-conferences.org/articles/e3sconf/pdf/2021/09/e3sconf_iaecst20_04004.pdf |