Investigations on elastic properties and electronic structures of α-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements
The low-temperature α-CoSn3 intermetallic compound (IMC) doped with Ni is an important component at the interface between Sn-based solder and printed circuit boards, which largely controls the mechanical properties of solder joints. However, the structure and elastic properties of α-CoSn3 doped with...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-12-01
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| Series: | Results in Physics |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379719320790 |