Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components’ Temperature
The previous work relating to the numerical-analytical coupling method for steady-state thermal analysis of the laminated PCB structure is first briefly reviewed. The Fourier-series analytical solution of temperature and the finite volume method were linked together for thermally modeling the PCB. F...
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
|
| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9466496/ |