Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives
The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial...
Main Authors: | , , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-08-01
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Series: | Journal of Composites Science |
Subjects: | |
Online Access: | https://www.mdpi.com/2504-477X/4/3/105 |