Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components
Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a humidity sensor, near field communication antenna an...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-12-01
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| Series: | Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-3900/2/13/748 |