Thermal Analysis of Ultimately-Thinned-and-Transfer-Bonded CMOS on Mechanically Flexible Foils

Thermal Analysis of Ultimately-Thinned-and-Transfer-Bonded CMOS on Mechanically Flexible Foils

Thinned CMOS chips transfer-bonded onto a compliant host substrate remain to date the technology of choice for applications requiring both mechanical flexibility and high frequency operation. However, the use of poorly thermally conductive host substrates raises the problem of thermal management of...

Full description

Bibliographic Details
Main Authors: Justine Philippe, Arun Bhaskar, Etienne Okada, Flavie Braud, Jean-Francois Robillard, Francois Danneville, Christine Raynaud, Daniel Gloria, Emmanuel Dubois
Format: Article
Language:English
Published: IEEE 2019-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
CMOS
SOI
thin film
flexible electronics
thermal management
Online Access:https://ieeexplore.ieee.org/document/8826282/

Internet

https://ieeexplore.ieee.org/document/8826282/

Similar Items