Effect of Fluid Media on Material Removal and Subsurface Defects Evolution of Monocrystal Copper in Nano-Cutting Process

Effect of Fluid Media on Material Removal and Subsurface Defects Evolution of Monocrystal Copper in Nano-Cutting Process

Abstract The effect of fluid media on material removal and subsurface defects evolution in nano-cutting process of single-crystal copper is investigated by means of molecular dynamics simulation. In this paper, the removal mechanism of the chip and formation mechanism of machined surface are investi...

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Bibliographic Details
Main Authors: Quanlong Wang, Chaofeng Zhang, Meiping Wu, Jiaxuan Chen
Format: Article
Language:English
Published: SpringerOpen 2019-07-01
Series:Nanoscale Research Letters
Subjects:
Nano-cutting
Fluid media
Materials removal
Subsurface defects evolution
Crystal structural transformation
Online Access:http://link.springer.com/article/10.1186/s11671-019-3065-0

Internet

http://link.springer.com/article/10.1186/s11671-019-3065-0

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