ENHANCED INTERFACE ADHESION OF PATTERN PLATED COPPER IN PRINTED WIRING BOARDS
Trend in electronic packaging towards reduction in the dimension of conductive tracks in printed wiring boards continues, adhesion at the interface between the laminated copper and the electroplated copper becoming critical issues. In order to improve the adhesion at copperto-copper interface, se...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
ICT Academy of Tamil Nadu
2019-04-01
|
| Series: | ICTACT Journal on Microelectronics |
| Subjects: | |
| Online Access: | http://ictactjournals.in/paper/IJME_Vol_5_Iss_1_Paper_7_744_749.pdf |