Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics
Wafer bonding is an attractive technology that can join homo/heterogeneous materials into one composite. It has a wide range of applications in the micro-electro-mechanical system (MEMS), integrated circuit, consumer and power electronics, micro/nanofluidics, etc. Since all devices on the same wafer...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2020-01-01
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| Series: | International Journal of Optomechatronics |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/15599612.2020.1857890 |