Numerical Investigation of a Novel Plate-Fin Indirect Evaporative Cooling System Considering Condensation
An indirect evaporative cooling system combining with thermoelectric cooling technology (i.e., TIEC system) is proposed, in which a counter-flow plate-fin indirect evaporative cooler is inserted with thermoelectric cooling (i.e., TEC) modules. In hot and humid climate, condensation may occur on the...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-02-01
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| Series: | Processes |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2227-9717/9/2/332 |