Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load
Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconnection between electronic chips and printed circuit boards, which are prone to failure and lead to electronic device failures under the action of vibration environment stress. In regard to the failure...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9519698/ |