INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP

INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP

The article considers the to enhance the efficiency the thermoelectric heat pump by making the branches of semiconductor p- and n-type as nanofilms and creating conditions for the emergence of additional thermoeffect between the hot and cold junctions of dissimilar metals that will create a more eff...

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Bibliographic Details
Main Authors: T. A. Ismailov, H. M. Gadjiyev, T. A. Chelushkina, D. A. Chelushkin
Format: Article
Language:Russian
Published: Daghestan State Technical University 2016-08-01
Series:Vestnik Dagestanskogo Gosudarstvennogo Tehničeskogo Universiteta: Tehničeskie Nauki
Subjects:
nanofilm thermoelectric heat pump
semiconductor branch
heat transfer
very large scale integration
Online Access:https://vestnik.dgtu.ru/jour/article/view/255

Internet

https://vestnik.dgtu.ru/jour/article/view/255

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