The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint
In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated. The interfacial microstructure of solder joint was refined with proper addition of Nd. This phenomenon could be explai...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-12-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/24/8935 |