Special Topic on Monolithic 3-D Integration for Energy-Efficient Computing
As the traditional 2-D scaling is approaching its physical limit, there is a great motivation to explore the third dimension for future integrated circuit design. The memory industry has already adopted monolithic 3-D integration (e.g., in 176-layer 3-D NAND Flash), while the 3-D vertical integratio...
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| Format: | Article |
| Language: | English |
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IEEE
2021-01-01
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| Series: | IEEE Journal on Exploratory Solid-State Computational Devices and Circuits |
| Online Access: | https://ieeexplore.ieee.org/document/9552630/ |