Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling

Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling

The increasing demand in automotive markets is leading the semiconductor industries to develop high-performance and highly reliable power devices. Silicon carbide MOSFET chips are replacing silicon-based solutions through their improved electric and thermal capabilities. In order to support the deve...

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Bibliographic Details
Main Authors: Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Applied Sciences
Subjects:
silver sintering
reliability
physical analyses
mechanical characterization
finite element analysis
Online Access:https://www.mdpi.com/2076-3417/11/15/7012

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https://www.mdpi.com/2076-3417/11/15/7012

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