Effect of scanning path on thermo-mechanical field of laser solid forming TC4 part

In order to mitigate both residual stress and distortion induced by large thermal gradient in laser solid forming (LSF) process, the <i>in-situ</i> measurement first was used to monitor the thermal and distortion evolutions of the substrate during LSF and to calibrate the finite element...

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Bibliographic Details
Main Authors: LU Xu-fei, LIN Xin, MA Liang, CAO Yang, HUANG Wei-dong
Format: Article
Language:zho
Published: Journal of Materials Engineering 2019-12-01
Series:Journal of Materials Engineering
Subjects:
Online Access:http://jme.biam.ac.cn/CN/Y2019/V47/I12/55