Effect of scanning path on thermo-mechanical field of laser solid forming TC4 part
In order to mitigate both residual stress and distortion induced by large thermal gradient in laser solid forming (LSF) process, the <i>in-situ</i> measurement first was used to monitor the thermal and distortion evolutions of the substrate during LSF and to calibrate the finite element...
Main Authors: | , , , , |
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Format: | Article |
Language: | zho |
Published: |
Journal of Materials Engineering
2019-12-01
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Series: | Journal of Materials Engineering |
Subjects: | |
Online Access: | http://jme.biam.ac.cn/CN/Y2019/V47/I12/55 |