Multi-strata subsurface laser die singulation to enable defect-free ultra-thin stacked memory dies
We report the extension of multi-strata subsurface infrared (1.342 μm) pulsed laser die singulation to the fabrication of defect-free ultra-thin stacked memory dies. We exploit the multi-strata interactions between generated thermal shockwaves and the preceding high dislocation density layers formed...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2015-05-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4921205 |