Leakage pressures for gasketless superhydrophobic fluid interconnects for modular lab-on-a-chip systems

Abstract Chip-to-chip and world-to-chip fluidic interconnections are paramount to enable the passage of liquids between component chips and to/from microfluidic systems. Unfortunately, most interconnect designs add additional physical constraints to chips with each additional interconnect leading to...

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Bibliographic Details
Main Authors: Christopher R. Brown, Xiaoxiao Zhao, Taehyun Park, Pin-Chuan Chen, Byoung Hee You, Daniel S. Park, Steven A. Soper, Alison Baird, Michael C. Murphy
Format: Article
Language:English
Published: Nature Publishing Group 2021-09-01
Series:Microsystems & Nanoengineering
Online Access:https://doi.org/10.1038/s41378-021-00287-6