TECHNOLOGICAL PARTICULARITIES OF THE CIRCUIT BOARD WITH THE BUILT-IN INTERCONNECTION SYSTEM FORMATION FOR THE ANODE ALUMINA SUBSTRATE
Results of the interconnection system formation during substrate anode alumina processing are presented. It is proved that anode Al2O3 substrate, interconnection system in the bulk and contact pads formation is possible simultaneously. The thickness of the anode Al2O3 substrate, the distribution of...
| Main Authors: | , |
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| Format: | Article |
| Language: | Russian |
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Educational institution «Belarusian State University of Informatics and Radioelectronics»
2019-06-01
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| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/171 |