Through Global Sharing to Improve Network Efficiency for Radio-Frequency Interconnect Based Network-on-Chip
According to the International Technology Roadmap for Semiconductors, improving characteristics of metal wires will no longer satisfy performance requirements, and new interconnect paradigms are needed. Radio frequency interconnect (RF-I) enjoys better CMOS compatibility compared with other alternat...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2016-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7582476/ |