Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application
Aiming to reduce flatness (Total Thickness Variation, TTV) defects in the lapping process of the silicon wafer manufacturing, it is crucial to understand and eliminate the root cause(s). Financial losses resulting from TTV defects make the lapping process unsustainable. DMAIC (Define, Measure, Analy...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Sciendo
2019-07-01
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| Series: | Engineering Management in Production and Services |
| Subjects: | |
| Online Access: | https://doi.org/10.2478/emj-2019-0013 |