Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods, is widely used in aeronautical industry field. According to the JEDEC standard, shock tests of PBGA assemblies are conducted under different loading conditions. Several important parameters, such as the fatigue li...

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Bibliographic Details
Main Authors: Jiang Shao, Hongjian Zhang, Bo Chen
Format: Article
Language:English
Published: MDPI AG 2019-03-01
Series:Electronics
Subjects:
PBGA
reliability
shock tests
failure life
Online Access:http://www.mdpi.com/2079-9292/8/3/279

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