Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading
Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods, is widely used in aeronautical industry field. According to the JEDEC standard, shock tests of PBGA assemblies are conducted under different loading conditions. Several important parameters, such as the fatigue li...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-03-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2079-9292/8/3/279 |