Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

• Main Authors: Jiang Shao, Hongjian Zhang, Bo Chen
• Format: Article
• Language: English
• Published: MDPI AG 2019-03-01
• Series: Electronics
• Subjects: PBGA; reliability; shock tests; failure life
• Online Access: http://www.mdpi.com/2079-9292/8/3/279

Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods, is widely used in aeronautical industry field. According to the JEDEC standard, shock tests of PBGA assemblies are conducted under different loading conditions. Several important parameters, such as the fatigue life of PBGA assemblies, the relationship between solder joint positions and fatigue life, the relationship between strain energy density and fatigue life, are analyzed based on experiment results. The failure modes of PBGA assemblies are studied by optical microscope (OM). The results show that during the shock tests, the strains of the solder joints near the center of the specimen are larger than other positions, and these solder joints are prone to form micro cracks. With the increase of the shock times, these micro cracks extend rapidly which will eventually cause the failure of the PBGA electronic packaging.