Theory and practice of vibration analysis in electronic packages
The paper represents theoretical and experimental vibration analysis of electronic packages. The research objectives are bearing parts, such as printed circuit boards, walls of the cases and electronic components, in enclosed electronic packages subjected to vibration during their operation. The the...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2018-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/201818202015 |