State of the Art and Future Perspectives in Advanced CMOS Technology

The international technology roadmap of semiconductors (ITRS) is approaching the historical end point and we observe that the semiconductor industry is driving complementary metal oxide semiconductor (CMOS) further towards unknown zones. Today’s transistors with 3D structure and integrated advanced...

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Main Authors: Henry H. Radamson, Huilong Zhu, Zhenhua Wu, Xiaobin He, Hongxiao Lin, Jinbiao Liu, Jinjuan Xiang, Zhenzhen Kong, Wenjuan Xiong, Junjie Li, Hushan Cui, Jianfeng Gao, Hong Yang, Yong Du, Buqing Xu, Ben Li, Xuewei Zhao, Jiahan Yu, Yan Dong, Guilei Wang
Format: Article
Language:English
Published: MDPI AG 2020-08-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/10/8/1555
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author Henry H. Radamson
Huilong Zhu
Zhenhua Wu
Xiaobin He
Hongxiao Lin
Jinbiao Liu
Jinjuan Xiang
Zhenzhen Kong
Wenjuan Xiong
Junjie Li
Hushan Cui
Jianfeng Gao
Hong Yang
Yong Du
Buqing Xu
Ben Li
Xuewei Zhao
Jiahan Yu
Yan Dong
Guilei Wang
spellingShingle Henry H. Radamson
Huilong Zhu
Zhenhua Wu
Xiaobin He
Hongxiao Lin
Jinbiao Liu
Jinjuan Xiang
Zhenzhen Kong
Wenjuan Xiong
Junjie Li
Hushan Cui
Jianfeng Gao
Hong Yang
Yong Du
Buqing Xu
Ben Li
Xuewei Zhao
Jiahan Yu
Yan Dong
Guilei Wang
State of the Art and Future Perspectives in Advanced CMOS Technology
Nanomaterials
CMOS
process integration
nano-scale transistors
epitaxy
author_facet Henry H. Radamson
Huilong Zhu
Zhenhua Wu
Xiaobin He
Hongxiao Lin
Jinbiao Liu
Jinjuan Xiang
Zhenzhen Kong
Wenjuan Xiong
Junjie Li
Hushan Cui
Jianfeng Gao
Hong Yang
Yong Du
Buqing Xu
Ben Li
Xuewei Zhao
Jiahan Yu
Yan Dong
Guilei Wang
author_sort Henry H. Radamson
title State of the Art and Future Perspectives in Advanced CMOS Technology
title_short State of the Art and Future Perspectives in Advanced CMOS Technology
title_full State of the Art and Future Perspectives in Advanced CMOS Technology
title_fullStr State of the Art and Future Perspectives in Advanced CMOS Technology
title_full_unstemmed State of the Art and Future Perspectives in Advanced CMOS Technology
title_sort state of the art and future perspectives in advanced cmos technology
publisher MDPI AG
series Nanomaterials
issn 2079-4991
publishDate 2020-08-01
description The international technology roadmap of semiconductors (ITRS) is approaching the historical end point and we observe that the semiconductor industry is driving complementary metal oxide semiconductor (CMOS) further towards unknown zones. Today’s transistors with 3D structure and integrated advanced strain engineering differ radically from the original planar 2D ones due to the scaling down of the gate and source/drain regions according to Moore’s law. This article presents a review of new architectures, simulation methods, and process technology for nano-scale transistors on the approach to the end of ITRS technology. The discussions cover innovative methods, challenges and difficulties in device processing, as well as new metrology techniques that may appear in the near future.
topic CMOS
process integration
nano-scale transistors
epitaxy
url https://www.mdpi.com/2079-4991/10/8/1555
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spelling doaj-1e19463b7889450dac09ad0268d34ded2020-11-25T03:15:49ZengMDPI AGNanomaterials2079-49912020-08-01101555155510.3390/nano10081555State of the Art and Future Perspectives in Advanced CMOS TechnologyHenry H. Radamson0Huilong Zhu1Zhenhua Wu2Xiaobin He3Hongxiao Lin4Jinbiao Liu5Jinjuan Xiang6Zhenzhen Kong7Wenjuan Xiong8Junjie Li9Hushan Cui10Jianfeng Gao11Hong Yang12Yong Du13Buqing Xu14Ben Li15Xuewei Zhao16Jiahan Yu17Yan Dong18Guilei Wang19Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaJiangsu Leuven Instruments, Xuzhou 221300, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaResearch and Development Center of Optoelectronic Hybrid IC, Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou 510535, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaKey Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, ChinaThe international technology roadmap of semiconductors (ITRS) is approaching the historical end point and we observe that the semiconductor industry is driving complementary metal oxide semiconductor (CMOS) further towards unknown zones. Today’s transistors with 3D structure and integrated advanced strain engineering differ radically from the original planar 2D ones due to the scaling down of the gate and source/drain regions according to Moore’s law. This article presents a review of new architectures, simulation methods, and process technology for nano-scale transistors on the approach to the end of ITRS technology. The discussions cover innovative methods, challenges and difficulties in device processing, as well as new metrology techniques that may appear in the near future.https://www.mdpi.com/2079-4991/10/8/1555CMOSprocess integrationnano-scale transistorsepitaxy