THERMAL CYCLING UNDER LOADING OF SINGLE CRYSTAL Cu-Al-Ni AFTER AGING
In this paper, a study of single crystal Cu-14.3Al-4.1Ni (%wt) subjected to thermal cycling under loading is presented. Shape memory Cu-Al-Ni has low diffusion at temperatures above room temperature. Therefore, it is interesting to know your answer in working conditions and after being aged in this...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | Spanish |
| Published: |
Executive Business School
2016-06-01
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| Series: | Avances en Ciencias e Ingeniería |
| Subjects: | |
| Online Access: | http://www.exeedu.com/publishing.cl/inicio.php?lnk=ctnd&id=362 |