Microstructure evolution mechanism and mechanical properties of AlN<sub>P</sub>/Al composites bonded to 6061Al at low temperature

Microstructure evolution mechanism and mechanical properties of AlN<sub>P</sub>/Al composites bonded to 6061Al at low temperature

In order to prevent the damage of the connected electronic components at high temperature and improve the wettability of the commonly used low-temperature SnAgCu(SAC) solder on the surface of the base material 25%AlN<sub>P</sub>/Al(volume fraction) composite and 6061Al alloy, the Ni thin...

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Bibliographic Details
Main Authors: LIN Pan-pan, MA Dian, LI Hao-yue, WANG Zi-ming, HE Peng, LIN Tie-song, LONG Wei-min
Format: Article
Language:zho
Published: Journal of Materials Engineering 2020-10-01
Series:Journal of Materials Engineering
Subjects:
magnetron sputtering
aln<sub>p</sub>/al composite material
low temperature brazing
snagcu solder
microstructure
mechanical property
Online Access:http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2019.000691

Internet

http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2019.000691

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