Agglomeration of Silicon Dioxide Nanoscale Colloids in Chemical Mechanical Polishing Wastewater: Influence of pH and Coagulant Concentration

Agglomeration of Silicon Dioxide Nanoscale Colloids in Chemical Mechanical Polishing Wastewater: Influence of pH and Coagulant Concentration

Chemical mechanical polishing (CMP) wastewater generated from semiconductor manufacturing industries is known to contain residual organic and inorganic contaminants, i.e. photoresists, acids, including silicon dioxide (SiO2), nanoparticles (NPs) and others. Nanoscale colloids in CMP wastewater have...

Full description

Bibliographic Details
Main Authors: Noor Aina Mohamad Zuki, Sin Jing Yao, Jada Amane, Dashti Arezoo Fereidonian, Fatehah Mohd Omar
Format: Article
Language:English
Published: Sciendo 2019-09-01
Series:Civil and Environmental Engineering Reports
Subjects:
cmp wastewater
nanoscale colloids
ph
zeta potential
particle size
ferrous sulfate heptahydrate
pacl
Online Access:https://doi.org/10.2478/ceer-2019-0040

Internet

https://doi.org/10.2478/ceer-2019-0040

Similar Items