Thermal Analysis of a Cracked Half-plane under Moving Point Heat Source

Thermal Analysis of a Cracked Half-plane under Moving Point Heat Source

The heat conduction in half-plane with an insulated crack subjected to moving point heat source is investigated. The analytical solution and the numerical means are combined to analyze the transient temperature distribution of a cracked half-plane under moving point heat source. The transient temper...

Full description

Bibliographic Details
Main Authors: He Kuanfang, Yang Qing, Xiao Dongming, Li Xuejun
Format: Article
Language:English
Published: Taiwan Association of Engineering and Technology Innovation 2017-09-01
Series:International Journal of Engineering and Technology Innovation
Subjects:
Heat conduction
Moving point heat source
Insulated crack
The moving coordinate method
Singular integral equation
Numerical solution method
Online Access:http://ojs.imeti.org/index.php/IJETI/article/view/381

Internet

http://ojs.imeti.org/index.php/IJETI/article/view/381

Similar Items