Microstructural Evolution and Growth Morphology During Formation Process of Full Cu<sub>3</sub>Sn Solder Joint in Microelectronic Packaging

Microstructural Evolution and Growth Morphology During Formation Process of Full Cu<sub>3</sub>Sn Solder Joint in Microelectronic Packaging

The full Cu<sub>3</sub>Sn solder joint has been widely used in 3D packaging gradually. 270℃ and 1N were chosen as soldering temperature and pressure respectively to fabricate solder joints under different soldering time in order to analyze the process of microstructural evolution.Cu<s...

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Bibliographic Details
Main Authors: LIANG Xiao-bo, LI Xiao-yan, YAO Peng, LI Yang, JIN Feng-yang
Format: Article
Language:zho
Published: Journal of Materials Engineering 2018-08-01
Series:Journal of Materials Engineering
Subjects:
Cu<sub>3</sub>Sn solder joint
Cu<sub>6</sub>Sn<sub>5</sub>
microstructural evolution
morphology
Online Access:http://jme.biam.ac.cn/CN/Y2018/V46/I8/106

Internet

http://jme.biam.ac.cn/CN/Y2018/V46/I8/106

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