Die sinter bonding in air using Cu@Ag particulate preform and rapid formation of near-full density bondline
Pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate was performed in air using an Ag-coated Cu (Cu@Ag) particulate preform to rapidly achieve a bondline with high-temperature sustainability, low-defect structure, and high thermal conductivity. The preform was pre...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421007225 |