Aggressive Exclusion of Scan Flip-Flops from Compression Architecture for Better Coverage and Reduced TDV: A Hybrid Approach

Aggressive Exclusion of Scan Flip-Flops from Compression Architecture for Better Coverage and Reduced TDV: A Hybrid Approach

Scan-based structural testing methods have seen numerous inventions in scan compression techniques to reduce TDV (test data volume) and TAT (test application time). Compression techniques lead to test coverage (TC) loss and test patterns count (TPC) inflation when higher compression ratio is targete...

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Bibliographic Details
Main Authors: Pralhadrao V. Shantagiri, Rohit Kapur
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Journal of Low Power Electronics and Applications
Subjects:
design for test
scan compression
patterns inflation
patterns count
test coverage
automatic test pattern generator
test data volume
test application time
scan chain
Online Access:https://www.mdpi.com/2079-9268/9/2/18

Internet

https://www.mdpi.com/2079-9268/9/2/18

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