Residual stress evolution regularity in thermal barrier coatings under thermal shock loading

Residual stress evolution regularity in thermal barrier coatings under thermal shock loading

Residual stress evolution regularity in thermal barrier ceramic coatings (TBCs) under different cycles of thermal shock loading of 1100°C was investigated by the microscopic digital image correlation (DIC) and micro-Raman spectroscopy, respectively. The obtained results showed that, as the cycle num...

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Bibliographic Details
Main Authors: Ximin Chen, Zhanwei Liu, Yang Yang
Format: Article
Language:English
Published: Elsevier 2014-01-01
Series:Theoretical and Applied Mechanics Letters
Subjects:
thermal barrier coating
residual stress
DIC
hole-drilling method
micro-Raman spectroscopy
Online Access:http://www.sciencedirect.com/science/article/pii/S2095034915303044

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http://www.sciencedirect.com/science/article/pii/S2095034915303044

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