Experimental investigation for modeling the hardening of thermosetting polymers during curing
During curing of thermosetting polymers, crosslinking results in hardening or stiffening of the material. In electronics, for example in encapsulating integrated circuits (die bonding), thermosets are fully cured in a controlled environment (under UV-light or within a thermal oven) such that the hig...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-10-01
|
| Series: | Polymer Testing |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941821002579 |