Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components

As a feasibility study, a direct ink writing process using a conventional FDM-printer and colloidal C–SiC pastes was developed. The pastes have a low content of organic additives, which enables the omission of a pyrolysis step, i.e. the green parts can undergo the liquid silicon infiltration process...

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Bibliographic Details
Main Authors: Alexander Held, Georg Puchas, Ferdinand Müller, Walter Krenkel
Format: Article
Language:English
Published: Elsevier 2021-03-01
Series:Open Ceramics
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2666539520300547