Direct ink writing of water-based C–SiC pastes for the manufacturing of SiSiC components
As a feasibility study, a direct ink writing process using a conventional FDM-printer and colloidal C–SiC pastes was developed. The pastes have a low content of organic additives, which enables the omission of a pyrolysis step, i.e. the green parts can undergo the liquid silicon infiltration process...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2021-03-01
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Series: | Open Ceramics |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2666539520300547 |