Modelling Thermal Resistance of Power Modules Having Solder Voids With Finite Elements
A general thermal model to calculate the thermal resistance of a power module having rectangular die and layers has been constructed. The model incorporates a finite element computer program to solve for three-dimensional heat conduction. Effects of voids in the solder regions are included. A sample...
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| Format: | Article |
| Language: | English |
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Hindawi Limited
1987-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/1987/19025 |