A non-linear analytic stress model for the analysis on the stress interaction between TSVs
Thermo-elastic strain is induced by through silicon vias (TSV) due to the difference of thermal expansion coefficients between the copper (∼18 ppm/◦C) and silicon (∼2.8 ppm/◦C) when the structure is exposed to a thermal budget in the three dimensional integrated circuit (3DIC) process. These thermal...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Chinese Institute of Automation Engineers (CIAE) & Taiwan Smart Living Space Association (SMART LISA)
2015-06-01
|
| Series: | International Journal of Automation and Smart Technology |
| Subjects: | |
| Online Access: | http://www.ausmt.org/index.php/AUSMT/article/view/323 |