Dynamic characteristics of an integrated cooling system comprising vapor compression and thermosyphon loop for electronics cooling
An integrated cooling system comprising passive cooling-thermosyphon loop and active cooling-vapor compression was proposed for the cooling of electronics, especially avionics, under a wide range of heat loads and ambient temperatures. A prototype of the integrated system with the weight of 2.8 kg w...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-12-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X21005876 |