Adjoint method for the optimization of insulated gate bipolar transistors

A mathematical algorithm is presented for the computation of optimum doping profiles that maximize the breakdown voltage and on-state current in insulated gate bipolar transistors (IGBT). The algorithm is based on the evaluation of doping sensitivity functions, which are defined as the functional de...

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Main Authors: C. Zhu, P. Andrei
Format: Article
Language:English
Published: AIP Publishing LLC 2019-09-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5113764
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spelling doaj-0ce42763dd5c46ce9036b658a5070b962020-11-24T20:46:38ZengAIP Publishing LLCAIP Advances2158-32262019-09-0199095301095301-1110.1063/1.5113764004909ADVAdjoint method for the optimization of insulated gate bipolar transistorsC. Zhu0P. Andrei1Department of Electrical and Computer Engineering, Florida State University, Tallahassee, Florida 32310, USADepartment of Electrical and Computer Engineering, Florida State University, Tallahassee, Florida 32310, USAA mathematical algorithm is presented for the computation of optimum doping profiles that maximize the breakdown voltage and on-state current in insulated gate bipolar transistors (IGBT). The algorithm is based on the evaluation of doping sensitivity functions, which are defined as the functional derivatives of the breakdown voltage and on-state current with respect to doping concentration. These functions are computed using an adjoint method and are used in combination with a gradient-based technique to search the optimization space of possible doping configurations efficiently. The mathematical algorithm is implemented numerically to optimize semiconductor devices that are simulated using finite element models and, then, applied to punch-through IGBTs with planar structure. In order to optimize the breakdown voltage it is shown that it is optimum to decrease the doping concentration in the drift region, particularly near the p-type junction on the emitter side and introduce p-type layers with low doping concentration in the drift region. In the case of the on-state current it is optimum to increase the n-type concentration the drift region, near the emitter junction. Depending on the initial structure and criteria imposed during the optimization, it is possible to increase the breakdown voltage by at least 5-10% and decrease the on-state voltage by at least 200 mV. The algorithm presented in this article can be easily extended to the optimization of three-dimensional doping profiles and to the optimization of other power devices, such that power p-n junctions and power metal-oxide-semiconductor field-effect-transistors.http://dx.doi.org/10.1063/1.5113764
collection DOAJ
language English
format Article
sources DOAJ
author C. Zhu
P. Andrei
spellingShingle C. Zhu
P. Andrei
Adjoint method for the optimization of insulated gate bipolar transistors
AIP Advances
author_facet C. Zhu
P. Andrei
author_sort C. Zhu
title Adjoint method for the optimization of insulated gate bipolar transistors
title_short Adjoint method for the optimization of insulated gate bipolar transistors
title_full Adjoint method for the optimization of insulated gate bipolar transistors
title_fullStr Adjoint method for the optimization of insulated gate bipolar transistors
title_full_unstemmed Adjoint method for the optimization of insulated gate bipolar transistors
title_sort adjoint method for the optimization of insulated gate bipolar transistors
publisher AIP Publishing LLC
series AIP Advances
issn 2158-3226
publishDate 2019-09-01
description A mathematical algorithm is presented for the computation of optimum doping profiles that maximize the breakdown voltage and on-state current in insulated gate bipolar transistors (IGBT). The algorithm is based on the evaluation of doping sensitivity functions, which are defined as the functional derivatives of the breakdown voltage and on-state current with respect to doping concentration. These functions are computed using an adjoint method and are used in combination with a gradient-based technique to search the optimization space of possible doping configurations efficiently. The mathematical algorithm is implemented numerically to optimize semiconductor devices that are simulated using finite element models and, then, applied to punch-through IGBTs with planar structure. In order to optimize the breakdown voltage it is shown that it is optimum to decrease the doping concentration in the drift region, particularly near the p-type junction on the emitter side and introduce p-type layers with low doping concentration in the drift region. In the case of the on-state current it is optimum to increase the n-type concentration the drift region, near the emitter junction. Depending on the initial structure and criteria imposed during the optimization, it is possible to increase the breakdown voltage by at least 5-10% and decrease the on-state voltage by at least 200 mV. The algorithm presented in this article can be easily extended to the optimization of three-dimensional doping profiles and to the optimization of other power devices, such that power p-n junctions and power metal-oxide-semiconductor field-effect-transistors.
url http://dx.doi.org/10.1063/1.5113764
work_keys_str_mv AT czhu adjointmethodfortheoptimizationofinsulatedgatebipolartransistors
AT pandrei adjointmethodfortheoptimizationofinsulatedgatebipolartransistors
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