Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management
Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to underst...
Main Authors: | Wang Kang-Jia, Pan Zhong-Liang |
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Format: | Article |
Language: | English |
Published: |
VINCA Institute of Nuclear Sciences
2016-01-01
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Series: | Thermal Science |
Subjects: | |
Online Access: | http://www.doiserbia.nb.rs/img/doi/0354-9836/2016/0354-98361603899W.pdf |
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