Thermal model for 3-D integrated circuits with integrated MLGNR-based through silicon via

by Xu Peng, Pan Zhong-Liang
Published 2020-01-01

Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management

by Wang Kang-Jia, Pan Zhong-Liang
Published 2016-01-01

An analytical thermal model for three-dimensional integrated circuits with integrated micro-channel cooling

by Wang Kang-Jia, Sun Hong-Chang, Pan Zhong-Liang
Published 2017-01-01