Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management

Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to underst...

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Bibliographic Details
Main Authors: Wang Kang-Jia, Pan Zhong-Liang
Format: Article
Language:English
Published: VINCA Institute of Nuclear Sciences 2016-01-01
Series:Thermal Science
Subjects:
Online Access:http://www.doiserbia.nb.rs/img/doi/0354-9836/2016/0354-98361603899W.pdf