Power Integrity Coanalysis Methodology for Multi-Domain High-Speed Memory Systems
With the increasing demand for state-of-the-art technologies, such as wearable devices and the Internet of things (IoT), power integrity has emerged as a major concern for high-speed, low-power interfaces that are used as mobile platforms. By using case-specific design models in a high-speed memory...
Main Authors: | Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang |
---|---|
Format: | Article |
Language: | English |
Published: |
IEEE
2019-01-01
|
Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/8763973/ |
Similar Items
-
High-speed PCB circuit power integrity simulation analysis
by: Meng Xiangsheng, et al.
Published: (2019-09-01) -
A Dual-Perforation Electromagnetic Bandgap Structure for Parallel-Plate Noise Suppression in Thin and Low-Cost Printed Circuit Boards
by: Myunghoi Kim
Published: (2019-06-01) -
Computation of Maximum Voltage Droop in Power Delivery Networks
by: Seunghyup Han, et al.
Published: (2020-01-01) -
Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
by: Liu, Xingsheng
Published: (2014) -
An Analysis of Variable-Speed Wind Turbine Power-Control Methods with Fluctuating Wind Speed
by: Seung-Il Moon, et al.
Published: (2013-07-01)