Ellipsometry and XPS comparative studies of thermal and plasma enhanced atomic layer deposited Al2O3-films
We report on results on the preparation of thin (<100 nm) aluminum oxide (Al2O3) films on silicon substrates using thermal atomic layer deposition (T-ALD) and plasma enhanced atomic layer deposition (PE-ALD) in the SENTECH SI ALD LL system. The T-ALD Al2O3 layers were deposited at 200 °C, for the...
Main Authors: | , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Beilstein-Institut
2013-11-01
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Series: | Beilstein Journal of Nanotechnology |
Subjects: | |
Online Access: | https://doi.org/10.3762/bjnano.4.83 |