Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader
In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state a...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
VINCA Institute of Nuclear Sciences
2016-01-01
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| Series: | Thermal Science |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/0354-9836/2016/0354-98361400143M.pdf |