Ejectorless Method for Die Attach Pick Up for Cracking Improvement on Thin High-Aspect Ratio Die
<p>The demand for producing small, thin, and light electronic devices is increasing. As a result, the design and assembly of electronic packaging technology have been developed. To meet the ever-increasing technology requirements, the critical process in the semiconductor packaging include waf...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
International Association of Online Engineering (IAOE)
2020-07-01
|
| Series: | International Journal of Online and Biomedical Engineering |
| Subjects: | |
| Online Access: | https://online-journals.org/index.php/i-joe/article/view/14727 |