Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In...

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Bibliographic Details
Main Authors: Tianshen Zhou, Shuying Ma, Daquan Yu, Ming Li, Tao Hang
Format: Article
Language:English
Published: MDPI AG 2020-07-01
Series:Sensors
Subjects:
CMOS image sensor
automotive
WLCSP
TSV
AEC-Q100
Online Access:https://www.mdpi.com/1424-8220/20/15/4077

Internet

https://www.mdpi.com/1424-8220/20/15/4077

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