Post-Sputtering Heat Treatments of Molybdenum on Silicon Wafer
This paper investigated the property evolutions of Mo thin films that were subjected to post-sputtering heat treatments from 700 °C to 1100 °C. It was found that, after annealing, the use of Si wafers eliminated crack formations found in previously reported Mo thin films sputtered on...
Main Authors: | , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2018-09-01
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Series: | Applied Sciences |
Subjects: | |
Online Access: | http://www.mdpi.com/2076-3417/8/9/1692 |