Advanced Interconnect and Packaging

Advanced Interconnect and Packaging

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...

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Bibliographic Details
Format: eBook
Language:English
Published: Basel MDPI - Multidisciplinary Digital Publishing Institute 2023
Subjects:
History of engineering and technology
Technology: general issues
3D IC
aging
antenna current
Au wire bonding
Au-Au bonding
average heat-spreading width
average power handling capability (APHC)
Bi aggregation
blood oxygen
broadband
broadside structure
carbon nanotube
circuit model
coverage thickness
Cu-CNT composite
Cu-Sn bonding
deadbeat controller
dual active bridge
electromagnetic bandgap (EBG)
electromigration
far-end crosstalk
flow time
focused ion beam (FIB)
frequency selective rasorber (FSR)
frequency selective surface (FSS)
frequency-selective surface analytical approximation
graphene
high-temperature annealing
high-temperature pressure sensor
high-temperature resistant packaging
hot-melt glass
impedance
integrated circuit interconnects
integrated passive device
interposer channel
interposers
kinetic inductance
load feedforward
low-loss substrates
low-temperature soldering
mathematical model
MEMS sensor
metallic bonding
morphology analysis
n/a
noise suppression structures
on-chip interconnect
on-chip spiral inductor
packages
parylene
physics-based modeling
power delivery network (PDN)
power/ground noise
Pt-Pt interconnection
quantum resistance
reliability
reliability evaluation
sensing array
silicon interposer
SiO2 and Au substrate
slow-wave transmission line (SWTL)
Sn-Bi solder
spoof surface plasmon polaritons (SSPP)
spoof surface plasmon polaritons (SSPPs)
substrate integrated waveguide (SIW)
temperature-dependent resistivity
thermal resistance
through-dielectric capacitor (TDC)
through-silicon-via (TSV)
transmission line model
vacuum degradation
vertical tabbed via
wearable device
wettability
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